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《武汉职业技术学院学报》[ISSN:1006-6977/CN:61-1281/TN]

卷:

期数:

2012年02期

页码:

30-35

栏目:

出版日期:

2012-04-15

文章信息/Info

Title:

Research on Development Trend of Taiwan IC Assembly and Test Industry and Work Place Practical Training

文章编号:

1671-931X （2012） 02-0030-06

作者:

林瑞鑫

侨光科技大学研究发展处，台湾台中40721

Author(s):

LIN Rui-xin

Overseas Chinese University, Taichung40721, China

关键词:

IC封测; 内存; 实务训练; 自动作业; 抽检作业

Keywords:

IC assembly and test industry;  stock;  practical training;  automatic operation

分类号:

TN407

文献标志码:

A

摘要:

由于2010年第四季电子产品之上下游库存水平偏低,促使系统厂商持续补充零组件库存,积极向IC厂商拉货,2010年台湾IC设计、DRAM、封测产值皆为正增长,而其中以台湾IC设计产业产值提升最大,带动2010年第一季台湾半导体产业整体产值达11,998百万美元,较前季成长3%。展望2011年第三季,由于系统厂商普遍为下半年的旺季作准备,第二季台湾半导体产业产值持续呈季增长,预估增长幅度达7%,为12,884百万美元,其中以DRAM产值增长最大,主要因为台湾DRAM厂商持续提高产能利用率,且台湾DRAM产品持

Abstract:

Because the stock of downstream and upstream electronic products in the fourth quarter of 2011 kept at a somewhat lower level, the system manufacturers were compelled to supplement the stock of spare part continually. In 2010 the output value of Taiwan IC design, DRAM and assembly and test industry all saw a growth, and among them the growth of design industry was the most dramatic, which had spurred the growth of semiconductor industry up to 11,998,000,000 US dollars in the first quarter of 2010, 3% more than that in the preceding quarter. It was estimated that the output value of semiconductor industry would continue to grow in the third quarter of the year, at a rate of 7% and up to12, 884,000,000 US dollars, as most of the suppliers were making ready for the next peak season. Because on one hand, the DRAM suppliers had enhanced continually its productivity and on the other hand, Taiwan DRAM product had been transferring to the high price DDR3, the output value of DRAM industry grew faster. Meanwhile, most IC design companies can expect considerable growth in turnover in the third quarter due to the large orders received, while the terminal market will witness a stable period as most system supplies stake on the peak season. Thus, it is estimated that output value of Taiwan IC design industry will continue to grow, at 5.1% for each quarter. Although output value of Taiwan IC design industry grows faster than it is anticipated in the first quarter, it will continue to rise in the second quarter. However, the question remains as to whether the growth can sustain to the next half year. What's more, the fact that the European sovereign debt crisis is certainly imposing the impact on the Euro— zone economy and it is even likely to spread to other regions in the globe may become the major variables influencing the global semiconductor market climate. Although Taiwan IC design industry and Europe market are by no means highly related, but owing to the chain reaction, it still may unavoidably come under the influence. In addition, the in— crease of sales of IC products in the first half of the year was partly due to the system manufacturers' expectation on a rising demand of global market in the year and their worries over the shortage of supply, given the hot demand of the part components. Thus, if the terminal demands failed to live up to system manufacturers' expectation, the problems of overstock would arise sooner or later which apparently would affect the sales performance of the third and fourth quar— ter. Therefore, it is safe to say that the output value of IC design industry of Taiwai in the second half of the year would be comparable to that of the first half of the year or even better, but the peak season prosperity would not appear in the third quarter. And the rate of increase is estimated to be at only 3.5% quarterly. The increase of sales of DRAM had promoted the turnover of DRAM in the first half of year gradually. As the DRAM is lucrative, and moreover, the manu— factures are optimistic about this surge of PC replacement, some Taiwan manufacturers are increasing the production of DRAM. Therefore, apparently there will be such a shortage of workforces in Taiwan semiconductor pure foundry indus— try that enterprises are considering working together with colleges to build off-campus internship base to train work— force. The paper sets out to discuss the feasibility of improving student's competitiveness by work place practical train— ing with IC assembly and test industry.

备注/Memo

备注/Memo:

收稿日期：2011-11-01 作者简介：林瑞鑫袁侨光科技大学研究发展处副研发长兼产学合作中心主任遥

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更新日期/Last Update: 2012-04-15